ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,678, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Vertical phase change switch util... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,678, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Vertical phase change switch util... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,679, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Deposition equipment with adj... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,679, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Deposition equipment with adj... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,680, issued on April 14, was assigned to SUMCO Corp. (Tokyo). "Method for manufacturing group III nitride semiconductor substrate" was inv... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,680, issued on April 14, was assigned to SUMCO Corp. (Tokyo). "Method for manufacturing group III nitride semiconductor substrate" was inv... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,681, issued on April 14, was assigned to SK hynix Inc. (Incheon, South Korea) and INCHEON NATIONAL UNIVERSITY RESEARCH & BUSINESS FOUNDATIO... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,682, issued on April 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Methods for patterning a semiconductor substrate using metalate sal... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,683, issued on April 14, was assigned to FENG CHIA UNIVERSITY (Taichung, Taiwan) and DAH YOUNG VACUUM EQUIPMENT Co. LTD. (Taichung City, Ta... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,684, issued on April 14, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method and system for mitigating underlayer damage du... Read More